Parameters of Automated Pcb Prototype Assembly |
Item | Description | Brand & Remark |
Equipments | Auto Printing Machine(Accuracy±0.01mm) | DEK,GKG |
High Speed Machine(Accuracy±0.001mm) | Panasonic-CM402/602,Fuji-NXTI/II |
Multi-Function Machine(Accuracy±0.001mm) | Panasonic-CM401,Yamaha-YVX100/200 |
Reflow(28 Temperature Area) | ERSA,Flowkawa |
AOI on line(Accuracy±0.001mm) | Omron |
AOI QC ((Accuracy±0.001mm) | DT,Mirtec |
Material | Resistor/Capacitor(Min size:0201, 01005) | Aillen,UniOhm,Yageo,Samsung,Murata,AVX,KEMET,etc. |
Diodes | ST,TI,Diodes,LRC,Fairchild,ON semi,Vishay,ect. |
Modules,Mosfet,QFP,ICs,BGA,CSP,QFN,etc. | Micochip,NVIDIA,HISILICON,INTEL,QUALCOMM,AMD,TI NXP etc. |
Buzzer,Speaker,Key,Led,LCD,etc. | Hongyun Group,Huiwei,Maibo,Harman etc. |
Crystal,Relay,Battery,Transformer,Inductor and others | TXC,EPSON,CHNT,Schneider,OMRON,HF,Siemens ect |
Connector,Socket,USB,Antenna,HDMI,WSGI and others | Molex,Tyco,Taisol,ECT,IPEX etc. |
Hardware and Plastic | Kunzhan,Shunho,Ihua etc. |
PCB(2,4,6,8,10,12 Layers) | Mektec,TTM,SCC,TRIPOD etc. |
Process | Side A | SMT |
Side A+Side B | SMT Dual side |
Side A+Assembly | SMT+HI |
Side A+Side B+Assembly | SMT Dual side+AI+HI |
Side A+AI(Auto Insertion)+Assembly | SMT+AI+HI |
Side A+AI(Auto Insertion)+RI(Auto Vertical Insertion)+Assembly | SMT+AI+RI+HI |
Side A+Side B+RI+Assembly | SMT Dual side+RI+HI(Hand Insertion) |
Operator | Over 3 years experience | Over High-school educated |
Engineer | Over 8 years experience | Over University educated,Diploma in electronic engineering and automation |
File Format | BOM,Gerber file,Pick-N-Place file |
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Testing | X-Ray Inspection,AOI Inspection,Function Testing,Burn-In testing,Thermal shock testing,Hot and Low temperature testing, etc. | Certificated by third party,UL,CE,3C,SGS,TUV etc. |